Semiconductor Engineering

Breakthrough Thin GaN Chiplet Technology

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...

Intel Touts Breakthrough With World's Thinnest GaN Chiplet For AI Chips

Intel has unveiled a Gallium Nitride (GaN) chiplet measuring a mere 19 micrometers in thickness. First showcased at the IEEE International Electron Devices Meeting in December last year, this ...

Here's the real reason SpaceX is teaming up with Intel on Terafab

An Intel blog post highlighted exciting technology SpaceX may need to use.
Fudzilla

Intel shows off ultra-thin GaN chiplet for data centres

Intel is showing off a wafer-thin trick that could shake up power-hungry kit. The chipmaker’s foundry boffins have built what they claim is the world’s thinnest GaN chiplet at just 19 micrometres.
Windows Report

Intel Foundry Unveils The Thinnest GaN Chiplet For Power And Logic

Intel Foundry developed the thinnest GaN chiplet to merge power and silicon logic on a single die. This 19-micrometer ...
New Electronics

Intel’s ultra‑thin GaN chiplet marks an inflection point

By embedding digital logic directly into the GaN chiplet, Intel collapses what is typically a small system into a single unit ...
DIGITIMES

Intel unveils ultra-thin GaN chiplet as it advances AI-era systems foundry strategy

Intel Foundry has announced a breakthrough in gallium nitride (GaN) chiplet technology, unveiling what it describes as the ...
Design And Reuse

Intel Foundry Achieves Breakthrough with World's Thinnest GaN Chiplet Technology

Intel Foundry has created the world's thinnest gallium nitride (GaN) chiplet — its base silicon measuring just 19 micrometers (μm) thick — harvested from a 300 millimeter (mm) GaN-on-silicon wafer.¹ ...
Blockonomi

Intel (INTC) Stock Soars 70% on Google Partnership and Terafab Collaboration

Intel (INTC) stock is up 70% in 2026 after strengthening its Google Cloud AI partnership and joining Elon Musk's Terafab chip ...
Semiconductor Engineering

Replay‑based Validation as a Scalable Methodology for Chiplet‑based Systems (Intel, Synopsys)

A new technical paper, “ODIN-Based CPU-GPU Architecture with Replay-Driven Simulation and Emulation,” was published by researchers at Intel, Nvidia and Synopsys. “Integration of CPU and GPU ...