MOUNTAIN VIEW, Calif.--Written off lately by the computer industry as a has-been, Sun Microsystems may still have a few tricks up its engineers' shirt sleeves. On Tuesday, Sun researchers plan to ...
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Photonic chip packaging can withstand extreme environments
Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic ...
Strength in advanced packaging and physical storage markets are driving a recovery in Electronics, and management recently boosted full-year EBITDA guidance on the strength of these segments.
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