The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the demand for higher performance in increasingly compact form factors [1]. Over ...

Flip chip packaging connects chips directly to boards using solder bumps, skipping the old wire bonding method for a more ...

Smart phones are a rapidly growing share of mobile phone shipments, representing 15% of the market in 2009 and growing to 35% in 2013. Essentially all the growth in mobile phone sales will come from ...

Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

The standard addresses both wire-bond and flip-chip substrates, with clearly defined requirements across design, manufacturing, quality control, and reliability.

SINGAPORE, Feb. 3, 2026 /PRNewswire/ -- FIC Global, Inc. (TWSE: 3701; FICG), with PRIME Technology as its optical communications brand, will participate in Asia Photonics Expo (APE) 2026, taking place ...

Powertech Technology (PTI) and its subsidiary test and assembly firm Greatek jointly held an online investor conference to discuss future operations. Greatek president Yu-Chang Chi said that driven by ...