The Ultra Accelerator Link Consortium recently ratified new UALink specifications, covering in‑network compute, chiplet ...

Through the collaboration, Silicon Box will work with industry leaders to advance automotive-grade chiplet devices with ...

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...

Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...

Sarcina launches UCIe-A/S Packaging IP, enabling high-performance, scalable chiplet interconnects with reduced ...

Taking advantage of IP such as processors and network-on-chips (NoCs) allows designers to quickly configure and build chiplet ...

Intel is showing off a wafer-thin trick that could shake up power-hungry kit. The chipmaker’s foundry boffins have built what they claim is the world’s thinnest GaN chiplet at just 19 micrometres.

At the sixth ACP Forum last November, Dr. BJ Han delivered a keynote on advanced packaging for automotive applications and ...

Chiplets—discrete semiconductor components co-designed and manufactured separately before being integrated into a larger system—are emerging as a groundbreaking approach to addressing many of the ...

What’s Arm up to in design and development of chiplets, the highly integrated large-scale silicon solutions? The IP giant is gradually unveiling its design blueprint for one of the most exciting ...