Then, in January 2024, the dormant fab was booted up again. Intel funneled billions into the facility, including $500 million ...

Researchers at the National Institute of Standards and Technology (NIST) have developed a new way to package photonic integrated circuits—tiny chips that convey information using light instead of ...

Nvidia has secured a dominant share of the world’s most advanced chip packaging capacity, concentrating its supply chain ...

There's a new bottleneck in AI chipmaking that almost all happens in Asia right now: advanced packaging. It connects smaller ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Intel (INTC) has been derided for squandering its leadership position in the chip race while also not leveraging its ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...

Amkor Technology is strengthening its position in advanced chip packaging. Vertiv is capitalizing on soaring demand for liquid cooling and power infrastructure. Both offer investors a unique way to ...

Artificial intelligence (AI) is reshaping the semiconductor landscape-both as a fast-growing end market and as a catalyst for innovation across mobile, automotive, networking, industrial and beyond.

Apple's imminent M5 Pro and M5 Max chips will run cooler and faster than ever before, as a year-old rumor about the way Apple Silicon chips are packaged resurfaces. Apple is anticipated to bring out ...