Texas Instruments revealed a family of isolated power modules based on its IsoShield multichip packaging technology, claiming 3X higher power density than discrete solutions in isolated power designs.

Texas Instruments (NasdaqGS:TXN) has introduced new isolated power modules that use its proprietary IsoShield packaging ...

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

Texas Instruments (TI) unveiled at the Applied Power Electronics Conference (APEC) 2026 isolated power modules that allow for increased power density, efficiency and safety in data centers, electric ...

Trinasolar has unveiled its newly upgraded Vertex N G3 module. Leveraging its advanced n-type i-TOPCon Ultra technology, the module now delivers a maximum power output of 760W, setting a new benchmark ...

Trinasolar has unveiled its newly upgraded Vertex N G3 modules on 25th March. Leveraging its advanced n-type i-TOPCon Ultra technology, the Vertex N G3 modules now deliver a maximum power output of ...

DC/DC converters for demanding applications, ranging from industrial, railway systems, and satellites to communications and ...

This March, Electronic Specifier's Associate Editor, Sheryl Miles, takes a look at the top 5 power products released in March ...

Sarcina launches UCIe-A/S Packaging IP, enabling high-performance, scalable chiplet interconnects with reduced ...

Kulicke and Soffa Industries recently introduced the ASTERION™-TW ultrasonic terminal welding system and the ProMEM memory-focused interconnect suite, expanding its ASTERION and memory packaging ...

A Form 4 filing with the U.S. Securities and Exchange Commission on Thursday revealed that Kim, Board Member at Amkor ...