The power modules target electric drive systems with power density, lower losses, & heat control, covering voltage & current ...

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

SiC and GaN device makers are using advanced junction structures and innovative packaging to offer more robust, cooler-running products. Advanced packaging technologies are also fueling the rise of ...

Beyond innovative power products, this edition features a heartwarming tale of a young scientist conducting amateur ...

This March, Electronic Specifier's Associate Editor, Sheryl Miles, takes a look at the top 5 power products released in March ...

Santa Clara, CA and Kyoto, Japan, March 17, 2026 (GLOBE NEWSWIRE)-- ROHM Semiconductor today announced it has released reference designs "REF68005", "REF68006", and "REF68004" for three-phase inverter ...

“We want to get rid of the dumb line frequency transformers. We want to move into more intelligent systems based on ...

Infineon has introduced the industry’s first TLVR-based quad-phase power module exceeding 2 A/mm², aimed at AI compute ...

Three-Phase Inverter Circuits Featuring ROHM's EcoSiC When combined with ROHM's SiC modules, these designs help reduce the ...

Infineon has brought out  a high‑current‑density quad‑phase power module with TLVR (trans‑inductor voltage regulator) ...

Summary onsemi announced a new design win with Sineng Electric, which will feature onsemi’s latest‑generation hybrid power integrated module ...