Abstract: Chiplet heterogeneous integration (CHI) is one of the important technology choices to continue Moore’s law. However, due to the characteristics of high power and low supply voltage in CHI ...
Abstract: This present report mainly covers 2.5/3DIC system efficient and accurate thermal analysis. This report not only conducts the thermal coupling among dies, PCB, package at system level, but ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results