New COMs from congatec fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards.

A new sensing solution combines RTK positioning and inertial tracking to deliver centimetre-level accuracy for robotics, drones, and field applications.

Today, as more countries commit to long-term net-zero goals, green and low-carbon development has become a shared global ...

Intel Core Ultra Series 3 Computer-on-Modules from congatec are hardened for harsh environments within the industrial ...

On 1 April 2026, the Artemis II mission was successfully launched from the Kennedy Space Center in Florida. The Space Launch System (SLS), developed by NASA, carried the Orion spacecraft and its crew: ...

An international study found that the specific power of commercial silicon solar modules increased from 8.5 W/kg in the early 2000s to 23.6 W/kg today, driven by advances in module design, bifaciality ...

Power device manufacturers exhibit their latest advances in topologies, packaging, and solutions at APEC 2026.

The hardware was assembled by connecting the Arduino UNO R4 WiFi, the PZEM 004T, the current transformer, and the OLED ...

On March 31, Fibocom announced that its Fx550 5G module (including FM550 M.2 form factor and FG550 LGA form factor), ...

STMicroelectronics continues to integrate its sensors, drivers, actuators, controllers, and development tools into the NVIDIA ...

Felicitysolar is proud to announce that its LiFePO4 battery, FLB48314TG1-H , has been awarded the prestigious 2026 Red Dot Design Award. This ...