Abstract: In this article, a high-efficient design method of through silicon via (TSV) array for thermal management of 3-dimensional (3-D) integrated system is developed based on the equivalent ...
Abstract: This article introduces a novel system designed to convey the three-dimensional positions surrounding the user. The system incorporates circumferential vibrotactile arrays strategically ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results