New COMs from congatec fast-track Intel Core Ultra Series 3 processors for embedded AI without discrete accelerator cards.

Within the projects MultiLASE (Funding Code 01QE2136C) and UltraLASE (Funding Code 01QE2309C), funded by the Federal Ministry for Research, Technology and Space BMFTR under the Eurostars program, ...

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SINGAPORE, March 2, 2026 /PRNewswire/ -- MetaOptics Ltd (Catalist: 9MT) ("MetaOptics" or the "Company", and together with its subsidiaries, the "Group") has announced plans to develop a compact ...

Kontron Electronics has expanded its embedded product range with the launch of the OSM‑S AM62L, a compact system‑on‑module built to the Open Standard Module (OSM) specification. The new module ...

Teledyne FLIR OEM, a part of Teledyne Technologies Incorporated (NYSE: TDY), today announced the launch of the Lepton ® XDS, a compact dual‑thermal‑and‑visible camera module bringing Teledyne FLIR’s ...

The Lepton XDS pairs a 160 × 120 radiometric Lepton 3.5 micro‑thermal camera with a five‑megapixel (MP) visible sensor, featuring MSX that enhances thermal imagery in real time by embossing ...

BARCELONA, Spain & GOLETA, Calif., February 24, 2026--(BUSINESS WIRE)--Teledyne FLIR OEM, a part of Teledyne Technologies Incorporated (NYSE:TDY), today announced the launch of the Lepton ® XDS, a ...

Enabling higher power delivery within the same rack space, Microchip’s MCPF1525 power module delivers up to 25 A per device and can be stacked to 200 A. The module integrates a 16-V IN buck converter ...

Tria Technologies has introduced a new Open Standard Module designed to support high‑performance, low‑power edge computing and artificial intelligence workloads. Compact OSM-LF-IMX95 module Credit: ...